Type number: SH-F series
Typical specifications:
T: (0.15/0.2/0.25/0.3/0.35/0.4/0.45 mm)
W:(6~1420mm can be arbitrarily cut)
L: (5~50m)
Product structure:
1, pure silicone type (Model: SH-F400)
2, polyimide membrane (PI) cladding type (Model: SH-F500)
3. TEFLON cladding type (Model: SH-F600)
Product features: with high heat transfer and buffering, will not cause damage to PCB, glass, etc., has a strong stability to heat, has a high resilience and non-adhesive.
Main application: This product is mainly used in the assembly process of TFT-LCD, and plays the heat conduction and buffering role of Heating tool in the process of compressed Flexible PCB to Glass pannel, which will not cause damage to PCB and Glass pannel under the action of heat and pressure in the assembly process.

shuohong	Shinetsu	Fuji	Comparison result
Press down 45 times	Press down 45 times	Press down 45 times	The indentation is obvious and does not appear locally In the case of abnormal indentation, the indentation performance of the composite material is normal and stable within the range of 50 times
Press down 50 times	Press down 50 times	Press down 50 times

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