Welcome to the website of Kunshan Shuohong Electronic Materials Co., Ltd

Home|Add to favorites|online|CN

News centerNEWS

current location:Home|News center

The heat conduction principle of thermal silicone sheet is explained in detail

Author: ComeFrom: Date:2015/6/17 20:14:17 Hits:7411
Heat dissipation silicone sheet, in the industry, also known as heat dissipation silicone pad, heat dissipation silicon film, soft heat dissipation pad, heat dissipation silicone gasket, etc., is a kind of heat conduction medium material synthesized by special process based on silicone as the base material, adding various auxiliary materials such as metal oxides. So what is the heat conduction principle of Kunshan thermal silicone sheet?
Cooling silicone sheet properties:
No matter what kind of heat dissipation device is used, if the close fit between the electronic components and the heat dissipation device is not good, there will be a lot of air between the components to prevent heat transfer, and the heat dissipation device will not be able to effectively reduce the heat of the electronic components. SR series products have very good thermal conductivity and filling, its own softness can fill the gap between the heating element and the cooling module, metal mechanism and housing, fast. The heat energy will be dissipated, improve the working efficiency of the components, and achieve the purpose of extending the life of the equipment. Ordinary heat dissipating silicone sheet, low thermal conductivity silicone sheet, double-sided heat dissipating silicone sheet, high heat dissipating silicone sheet, heat dissipating silicon sheet. At present, the thermal conductivity of domestic thermal silicone sheet is from 0.8W/M.K to 4.5W/M.K, there are three test standards for thermal conductivity, and the data obtained by different test standards will be different, and so on....
Cooling silicone sheet principle:
When there is no thermal interface material between the heating chip and the heat sink, the path through which the heat flow passes on the two connecting surfaces. When the thermal interface material is used between the heating chip and the heat sink, the path through which the heat flow passes on the two connecting surfaces.
The above is the heat conduction principle of the cooling silicone sheet arranged by Kunshan Shuohong Electronic materials, welcome to continue to pay attention.
Copyright: Kunshan Shuohong Electronic Technology Co., Ltd. Phone: 0512-55197362 Fax: 0512-55197350
Address: No. 1289 Zizhu Road, Chengbei, Yushan Town, Kunshan City, Jiangsu Province技术支持:仕德伟科技 苏ICP备19027936号
昆山市硕鸿电子科技有限公司
customer service